Method of singularizing packages and leadframe
A method of singularizing a matrix array of packages is provided, wherein the method comprises providing a matrix array of packages, wherein the matrix array is formed on a leadframe; cutting predefined leads of the leadframe by a punching process; and singularizing the packages of the matrix array...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
25.11.2015
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Subjects | |
Online Access | Get full text |
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Summary: | A method of singularizing a matrix array of packages is provided, wherein the method comprises providing a matrix array of packages, wherein the matrix array is formed on a leadframe; cutting predefined leads of the leadframe by a punching process; and singularizing the packages of the matrix array of packages by a sawing process. |
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Bibliography: | Application Number: CN20151234604 |