Method of singularizing packages and leadframe

A method of singularizing a matrix array of packages is provided, wherein the method comprises providing a matrix array of packages, wherein the matrix array is formed on a leadframe; cutting predefined leads of the leadframe by a punching process; and singularizing the packages of the matrix array...

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Bibliographic Details
Main Authors THIONG ZHOU SEE, LAY YEAP LIM, NEE WAN KHOO
Format Patent
LanguageEnglish
Published 25.11.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of singularizing a matrix array of packages is provided, wherein the method comprises providing a matrix array of packages, wherein the matrix array is formed on a leadframe; cutting predefined leads of the leadframe by a punching process; and singularizing the packages of the matrix array of packages by a sawing process.
Bibliography:Application Number: CN20151234604