Process cavity

The invention relates to a process cavity, which comprises an upper shield, a transition plate, a cavity body and a cooling base, wherein the transition plate is fixed in the cavity body; the upper shield is fixed at the inner side of the transition plate; the cooling base is arranged in the cavity...

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Bibliographic Details
Main Authors GUO HAO, YANG JINGSHAN
Format Patent
LanguageEnglish
Published 25.11.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a process cavity, which comprises an upper shield, a transition plate, a cavity body and a cooling base, wherein the transition plate is fixed in the cavity body; the upper shield is fixed at the inner side of the transition plate; the cooling base is arranged in the cavity body and can move up and down inside the cavity body; the cooling base is provided with an air channel, and the opening of the air channel is located on the surface for placing the wafer of the cooling base. The process cavity of the invention adopts a back pressure cooling mode, the air channel is arranged in the cooling base, a wafer placed on the cooling base is cooled through passing air in the air channel, heat generated during the process is timely transferred to the cooling base, deformation of the wafer or impurity volatilization caused by over high temperature of the wafer can be avoided, a high etching rate can be used, the process time does not need to be increased, and the processing efficiency is improved.
Bibliography:Application Number: CN20141186979