Bearing device, reaction chamber and semiconductor machining equipment

• Main Author: WU XUEWEI
• Format: Patent
• Language: English
• Published: 25.11.2015
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The intention provides a bearing device, a reaction chamber and semiconductor machining equipment. The bearing device comprises a tray, a base and a pressing ring, wherein the tray is used for bearing a workpiece to be machined; the base is used for bearing the tray; the pressing ring is used for fixing the tray to the base. In addition, the lower surface of the pressing ring is provided with a ring-shaped plane attached to the edge area of the upper surface of the tray, and the edge area of the upper surface of the tray is further provided with a ring-shaped concave part. The ring-shaped concave part overlaps the ring-shaped area, located on the periphery of a ring hole of the pressing ring, of the ring-shaped plane, and the inner edge of the ring-shaped concave part is located on the inner side of the ring hole of the pressing ring. According to the bearing device, when the pressing ring is separated from the tray, not only is formation of contamination particles avoided, but also the pressing ring is prevented from damaging the tray.