Printed wiring board and semiconductor device provided with same

• Main Author: HASHIMOTO TATSUHIRO
• Format: Patent
• Language: English
• Published: 18.11.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

The present invention relates to a printed wiring board and a semiconductor device provided with same. The printed wiring board (10) has a semiconductor package (20) mounted on a surface, said semiconductor package being configured by encapsulating a semiconductor chip (22) using an insulating material (23). The printed wiring board is provided with an insulating board (11), and an electrically connecting section (14, 140), which is provided on a surface of the insulating board, and which is connected to the semiconductor package using a solder (21). The electrically connecting section has a center portion (141) positioned at the center of the surface in contact with the solder, and a pair of extending portions (142) that extend to both the sides from the center portion. The extending direction of the extending portion intersects the direction in which the semiconductor package shrinks with heat.