Adhesive able to realize rapid bonding and rapid separation and preparation method thereof
The invention relates to an adhesive able to realize rapid bonding and rapid separation. The adhesive is composed of a component A and a component B in a weight ratio of 1:1. The component A comprises: 40-65 parts of special epoxy resin, 6-19 parts of thermoplastic phenolic resin, 5-20 parts of a di...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
18.11.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to an adhesive able to realize rapid bonding and rapid separation. The adhesive is composed of a component A and a component B in a weight ratio of 1:1. The component A comprises: 40-65 parts of special epoxy resin, 6-19 parts of thermoplastic phenolic resin, 5-20 parts of a diluent, 1-6 parts of a thermal expansion agent, 1-10 parts of a water decomposition additive, 5-20 parts of a desiccant, and 0.5-5 parts of a thixotropic agent. The component B comprises: 40-70 parts of a curing agent, 6-12 parts of a diluents, 0.5-5 parts of a degumming accelerator, 1-15 parts of a water decomposition additive, 15-35 parts of a desiccant, and 0.5-5 parts of a thixotropic agent. As a crystal holder-glass temporary bonding glue, the product provided by the invention has fast bonding speed, and at the end of wafer cutting, the crystal holder and glass plate can be immersed in hot water to realize rapid degumming and separation. No harmful gas is generated, the adhesive is energy saving and environment-friendly, and the production efficiency of solar crystal silicon slices is significantly enhanced. |
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Bibliography: | Application Number: CN20151459139 |