Polyimide film material capable of serving as conducting film substrate and preparing method of polyimide film material

• Main Authors: LU YUNHUA, WANG YONGFEI, HU ZHIZHI, DONG YAN, CHI HAIJUN, FANG QINGXU, LI XIAO, ZHAO HONGBIN, XIAO GUOYONG
• Format: Patent
• Language: English
• Published: 11.11.2015
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The invention discloses a polyimide film material capable of serving as a conducting film substrate. Polyimide has the following chemical structural formula (please see the formula in the specification). Dianhydride monomers of an alicyclic structure are high in molecule rigidity, and the polyimide prepared based on the dianhydride monomers has the good heat resistance and the good mechanical performance; the alicyclic structure contains little or no -CH2 and other light absorbing perssad, the conjugated structure is reduced, and thus the polyimide can have high transparency. By means of introduction of -CF3 perssad and ether bonds in fluorine-containing phenylate aromatic diamine, the solubleness and the heat stability of the polyimide can be improved, the dielectric constant and the hygroscopicity of the polyimide are reduced, and the transparency of the polyimide can be improved. Thus, the polyimide integrates the high-temperature resisting feature of PI, and the superior optical performance of the polyimide is highlighted. The ultraviolet cut-off wavelength of the polyimide is 280-330 nm, the light transmittance at 450 nm is higher than 90%, and the glass-transition temperature ranges from 250 DEG C to 300 DEG C.