Substrate conveyance mechanism, and component mounting device

The present invention is configured so as to be provided with a clamp mechanism (16) with which substrates (3A, 3B) are clamped and secured by bringing, from below and in a substrate-conveyance direction, clamp members into contact with clamp sites (3c) on undersurfaces of the conveyed substrates (3...

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Bibliographic Details
Main Authors IIZUKA KIMIO, MAKINO YOICHI, SAKURAI KOJI, NAGAYA TOSHIHIKO, FUJIWARA HIROYUKI, KONDA YOSHINORI, KUBOTA SHUUICHI, OGATA SHIGEO, YAMAMOTO SHINJI
Format Patent
LanguageEnglish
Published 04.11.2015
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