Substrate conveyance mechanism, and component mounting device

• Main Authors: IIZUKA KIMIO, MAKINO YOICHI, SAKURAI KOJI, NAGAYA TOSHIHIKO, FUJIWARA HIROYUKI, KONDA YOSHINORI, KUBOTA SHUUICHI, OGATA SHIGEO, YAMAMOTO SHINJI
• Format: Patent
• Language: English
• Published: 04.11.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention is configured so as to be provided with a clamp mechanism (16) with which substrates (3A, 3B) are clamped and secured by bringing, from below and in a substrate-conveyance direction, clamp members into contact with clamp sites (3c) on undersurfaces of the conveyed substrates (3...