Substrate conveyance mechanism, and component mounting device

The present invention is configured so as to be provided with a clamp mechanism (16) with which substrates (3A, 3B) are clamped and secured by bringing, from below and in a substrate-conveyance direction, clamp members into contact with clamp sites (3c) on undersurfaces of the conveyed substrates (3...

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Main Authors IIZUKA KIMIO, MAKINO YOICHI, SAKURAI KOJI, NAGAYA TOSHIHIKO, FUJIWARA HIROYUKI, KONDA YOSHINORI, KUBOTA SHUUICHI, OGATA SHIGEO, YAMAMOTO SHINJI
Format Patent
LanguageEnglish
Published 04.11.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention is configured so as to be provided with a clamp mechanism (16) with which substrates (3A, 3B) are clamped and secured by bringing, from below and in a substrate-conveyance direction, clamp members into contact with clamp sites (3c) on undersurfaces of the conveyed substrates (3A, 3B), said clamp sites being set as ends at both sides of the substrates. Furthermore, the present invention is configured so as to include: first clamp members (18a) which are commonly used when conveying either of the substrates (3A, 3B); and second clamp members (18b) which are selectively and exchangeably added to the first clamp members (18a) and used in accordance with the length (La, Lb) when conveying any one of the substrates (3A, 3B).
Bibliography:Application Number: CN2014812800