Heat-curable composition, surface sealing material for organic EL element, and cured object obtained therefrom

The purpose of the present invention is to provide a heat-curable composition which can form a cured layer having a highly smooth surface on an object to be coated, e.g., an organic EL element, with little ruggedness or cissing. This heat-curable composition comprises (A) a cationically polymerizabl...

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Bibliographic Details
Main Authors YAMAMOTO YUGO, OKABE JUN
Format Patent
LanguageEnglish
Published 04.11.2015
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The purpose of the present invention is to provide a heat-curable composition which can form a cured layer having a highly smooth surface on an object to be coated, e.g., an organic EL element, with little ruggedness or cissing. This heat-curable composition comprises (A) a cationically polymerizable compound having two or more cationically polymerizable functional groups in the molecule, (B) an initiator for thermal cationic polymerization, (C) a polyether compound (which is not the compound having cationically polymerizable functional groups), and (D) a leveling agent. The composition has a viscosity, as measured with an E-type viscometer at 25 DEG C and 2.5 rpm, of 50-30,000 mPa*s.
Bibliography:Application Number: CN201480012025