Preparing method for polyamide hot melt adhesive

• Main Authors: LI ZHELONG, ZHU WANYU, XUE WEILAN, ZHOU LEI, ZENG ZUOXIANG
• Format: Patent
• Language: English
• Published: 07.10.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention relates to a preparing method for polyamide hot melt adhesive, in particular to a preparing method for polyamide hot melt adhesive resistant to high temperature, high in melting point and narrow in melting range. According to the technical scheme, the preparing method is characterized in that two kinds of binary acid, the proportion and design of two kinds of diamine, caprolactam and monobasic acid are carefully selected, and the polyamide hot melt adhesive resistant to high temperature, high in melting point and narrow in melting range is obtained by a common method. The performance requirements of special field application are met, and the cost can be effectively lowered. The polyamide hot melt adhesive prepared through the preparing method can meet the requirement for adhering to automobile components and electronic components of which the working condition temperature reaches 140 DEG C.