Film layer peeling device and film layer peeling method

The invention discloses a film layer peeling device comprising a fixing mechanism used for fixing a substrate, wherein a film layer to be peeled is arranged on the substrate. The device also comprises a peeling mechanism comprising a peeling starter and a holding part. The peeling starter is used fo...

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Bibliographic Details
Main Authors CAI HONGQIAN, MA NAN, PANG JIANJUN
Format Patent
LanguageEnglish
Published 23.09.2015
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Summary:The invention discloses a film layer peeling device comprising a fixing mechanism used for fixing a substrate, wherein a film layer to be peeled is arranged on the substrate. The device also comprises a peeling mechanism comprising a peeling starter and a holding part. The peeling starter is used for peeling at least one part of the edge of the film layer. The holding part is used for holding the peeled part of the film layer, and can perform relative movement relative to the fixing mechanism towards the direction away from the peeled part on the film layer. Correspondingly, the invention discloses a film layer peeling method utilizing the film layer peeling device. With the device and the method, film layer peeling efficiency can be improved, and adhesive tape application can be reduced.
Bibliography:Application Number: CN20151250995