Abstract A grinding device (10) is provided with: a controller (11) that controls the entire device; a grinding motor (14); a base (15) that is rotated by the grinding motor (14); and a grinding stone (16) affixed to the base (15). In a grinding step, the grinding device (10) is used to grind the surface (19) of an article (18) to be polished by means of the grinding stone (16) rotated at a circumferential speed of no greater than 10 m/s. In the grinding step, the surface (19) of the article (18) to be polished is preferably ground by means of the grinding stone (16) rotated at a circumferential speed of at least 0.5 m/s. In the grinding step, the surfaces of alumina, sapphire, silicon carbide, and gallium nitride are ground as the articles to be polished. Also, a lapping step for polishing the post-grinding article to be polished by means of abrasive grit is preferably included.
AbstractList A grinding device (10) is provided with: a controller (11) that controls the entire device; a grinding motor (14); a base (15) that is rotated by the grinding motor (14); and a grinding stone (16) affixed to the base (15). In a grinding step, the grinding device (10) is used to grind the surface (19) of an article (18) to be polished by means of the grinding stone (16) rotated at a circumferential speed of no greater than 10 m/s. In the grinding step, the surface (19) of the article (18) to be polished is preferably ground by means of the grinding stone (16) rotated at a circumferential speed of at least 0.5 m/s. In the grinding step, the surfaces of alumina, sapphire, silicon carbide, and gallium nitride are ground as the articles to be polished. Also, a lapping step for polishing the post-grinding article to be polished by means of abrasive grit is preferably included.
Author KITAMURA KAZUMASA
NAGAE TOMOKI
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Snippet A grinding device (10) is provided with: a controller (11) that controls the entire device; a grinding motor (14); a base (15) that is rotated by the grinding...
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SubjectTerms AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CRYSTAL GROWTH
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METALLURGY
PERFORMING OPERATIONS
POLISHING
PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
REFINING BY ZONE-MELTING OF MATERIAL
SEMICONDUCTOR DEVICES
SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
SINGLE-CRYSTAL-GROWTH
TRANSPORTING
UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
Title Method for producing polished article
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