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Summary:A grinding device (10) is provided with: a controller (11) that controls the entire device; a grinding motor (14); a base (15) that is rotated by the grinding motor (14); and a grinding stone (16) affixed to the base (15). In a grinding step, the grinding device (10) is used to grind the surface (19) of an article (18) to be polished by means of the grinding stone (16) rotated at a circumferential speed of no greater than 10 m/s. In the grinding step, the surface (19) of the article (18) to be polished is preferably ground by means of the grinding stone (16) rotated at a circumferential speed of at least 0.5 m/s. In the grinding step, the surfaces of alumina, sapphire, silicon carbide, and gallium nitride are ground as the articles to be polished. Also, a lapping step for polishing the post-grinding article to be polished by means of abrasive grit is preferably included.
Bibliography:Application Number: CN2014803235