Holding table

The invention provides a holding table in which an annular reinforcing part can be stably eliminated and narrowing of a device area is prevented in a wafer that is provided with the annular reinforcing part at the periphery of the device area. The holding table (5) holds the wafer (W). The front sur...

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Bibliographic Details
Main Authors TAKESHI DEJIMA, TOSHIO TSUCHIYA, SAKI KIMURA
Format Patent
LanguageEnglish
Published 05.08.2015
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:The invention provides a holding table in which an annular reinforcing part can be stably eliminated and narrowing of a device area is prevented in a wafer that is provided with the annular reinforcing part at the periphery of the device area. The holding table (5) holds the wafer (W). The front surface of the wafer is provided with the device area (83) and a peripheral remaining area (84). A plurality of devices are formed in the device area. The peripheral remaining area surrounds the device area. The back surface of the wafer, which corresponds with the peripheral retaining area, is provided with the annular reinforcing part (85). The holding table (5) has a structure that the upper surface of the holding table is provided with an annular radiating trough (53) which is used for radiating laser light at a position which corresponds with the annular reinforcing part and the boundary part (86) of the device area. The bottom (54) of the radiating trough is provided with fine recesses and projections for radiating the laser light in conical shapes.
Bibliography:Application Number: CN2015159595