Low-PH (potential of hydrogen) polyamide molding composition

• Main Authors: XIA SHIYONG, CHEN DAHUA, ZHANG CHUANHUI, WANG PENG, CAO MIN, YANG CHUNER, YE NANBIAO, ZENG XIANGBIN, XIE XIANG, CAI TONGMIN
• Format: Patent
• Language: English
• Published: 29.07.2015
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses low-PH (potential of hydrogen) polyamide molding composition. The composition comprises components as follows: A, 30wt%-99wt% of polyamide resin, B, 0wt%-70wt% of reinforcing filler and C, 0wt%-70wt% of an additive and/or other polymer, wherein the PH value of the polyamide r...