Low-PH (potential of hydrogen) polyamide molding composition

• Main Authors: XIA SHIYONG, CHEN DAHUA, ZHANG CHUANHUI, WANG PENG, CAO MIN, YANG CHUNER, YE NANBIAO, ZENG XIANGBIN, XIE XIANG, CAI TONGMIN
• Format: Patent
• Language: English
• Published: 29.07.2015
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses low-PH (potential of hydrogen) polyamide molding composition. The composition comprises components as follows: A, 30wt%-99wt% of polyamide resin, B, 0wt%-70wt% of reinforcing filler and C, 0wt%-70wt% of an additive and/or other polymer, wherein the PH value of the polyamide resin in phenol is larger than or equal to 2 and smaller than or equal to 6; the sum of weight percent of A, B and C is 100wt%. According to the low-PH polyamide molding composition, the content [m] of an apparent carboxyl group obtained through measurement by an automatic potentiometric titrator is smaller than or equal to 550 mole/ton. The polyamide molding composition with specific PH is prepared from polyamide resin with a specific pH value, polyamide resin can be effectively prevented from being degraded and generating gas in an injection molding process, further, the technical problems of flow marks, local blanching and the like are solved, and the color of the polyamide molding composition is improved.