Mold and mold film-plating method

A mold is provided with a mold cavity, and the surface of the mold cavity is provided with a self-assembled single-molecule fluorine-containing polymer film layer, wherein the self-assembled single-molecule fluorine-containing polymer film layer is bonded on the surface of the mold cavity by silicon...

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Bibliographic Details
Main Authors LIU RICHENG, YE HONGLIAN, WANG ZHONGPEI, DAI FENGYUAN
Format Patent
LanguageEnglish
Published 08.07.2015
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:A mold is provided with a mold cavity, and the surface of the mold cavity is provided with a self-assembled single-molecule fluorine-containing polymer film layer, wherein the self-assembled single-molecule fluorine-containing polymer film layer is bonded on the surface of the mold cavity by silicon-oxygen bonds. The invention also relates to a mold film-plating method.
Bibliography:Application Number: CN2014108016