Radiator and radiator group

• Main Authors: DONG YUAN, FENG MINGXIN, HAO MINGLIANG
• Format: Patent
• Language: English
• Published: 01.07.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The embodiment of the invention discloses a radiator. An air guide cover is arranged to be vertical to a first micro channel, and a baffle is arranged above the air guide cover. The air guide cover comprises at least one air inlet channel and at least one air outlet channel, and the air inlet channels and the air outlet channels are arranged adjacent to each other and at intervals. The first micro channel comprises a bottom plate and at least two fins, the fins are erected on the bottom plate in parallel, and two adjacent fins form a radiating channel. The air inlet channels and the air outlet channels of the air guide cover and the radiating channels of the first micro channel perpendicularly intersect in arrangement. The embodiment of the invention further discloses a radiator group. According to the embodiment of the invention, the radiating capability per unit volume of the radiator can be improved, and the air-cooling radiating problem of a high-power-consumption chip can be solved.