Circuit board hole position correcting method

• Main Authors: XIA TIANTIAN, GUO MIAOHUA, XIE YONGDE, YE HONGFA, ZHENG PING, HAN TAO, HUI XIAOPING
• Format: Patent
• Language: English
• Published: 24.06.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a circuit board hole position correcting method. The method comprises the steps that a first edge, a second edge and a third edge are sequentially connected to the portions, close to a circuit board, of the board hole pre-forming position, and a first arc position correcting groove, a second arc position correcting groove and a third arc position correcting groove are correspondingly formed in the inner side of the first edge, the inner side of the second edge and the inner side of the third edge of the circuit board respectively and are concentric with the board hole pre-forming position; a fourth edge and a fifth edge are connected to the portion, close to the circuit board, of the board hole pre-forming position, and a fourth arc position correcting groove and a fifth arc position correcting groove are correspondingly formed in the inner side of the fourth edge and the inner side of the fifth edge of the circuit board respectively and are concentric the board hole pre-forming position; then a board hole is drilled in the board hole pre-forming position. Internal stress in the circuit board can be unloaded and balanced in all directions, and the board hole is prevented from deviating in the hole drilling process or after drilling is finished.