Phosphorus, arsenic and antimony co-doped N-type heavily-doped Czochralski silicon single crystal and silicon epitaxial wafer thereof
The invention discloses a phosphorus, arsenic and antimony co-doped N-type heavily-doped Czochralski silicon single crystal and a silicon epitaxial wafer thereof. The phosphorus, arsenic and antimony co-doped N-type heavily-doped Czochralski silicon single crystal takes phosphorus as the main doping...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English |
Published |
17.06.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a phosphorus, arsenic and antimony co-doped N-type heavily-doped Czochralski silicon single crystal and a silicon epitaxial wafer thereof. The phosphorus, arsenic and antimony co-doped N-type heavily-doped Czochralski silicon single crystal takes phosphorus as the main doping element, and either or both of arsenic and antimony as auxiliary doping elements, the concentration of phosphorus is larger than or equal to 4.6*10 /cm , phosphorus accounts for more than or equal to 60% of the doping elements, and the auxiliary doping elements accounts for 0.1-40% of the doping elements. The phosphorus, arsenic and antimony co-doped N-type heavily-doped Czochralski silicon single crystal can eliminate or remarkably reduce slip lines caused by lattice mismatching in the silicon epitaxial wafer, and can effectively reduce or eliminate mismatched dislocation lines generated when an epitaxial layer is grown on a polished wafer formed by processing of the N-type heavily-doped Czochralski silicon single crystal with high doping concentration; while the problems are solved, widening of a transition zone in a semi-conductor device after a high-temperature process is prevented; the industry practice that two or more of phosphorus, arsenic and antimony in a silicon single crystal cannot serve as dopants at the same time is changed. |
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Bibliography: | Application Number: CN201510083673 |