Organic silicon packaging silica gel composition for COB (chip on board) packaging and preparation method for composition

• Main Authors: CHEN WEI, XU QINGKUN, WANG JIANBIN, CHEN TIANAN
• Format: Patent
• Language: English
• Published: 17.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention relates to organic silicon packaging silica gel composition, in particular to the organic silicon packaging silica gel composition for COB (chip on board) packaging. The technical scheme adopted by the invention is as follows: the composition comprises a component A and a component B at a weight ratio of 1:1, wherein the component A comprises the following raw materials in parts by weight: 50-60 parts of methyl vinyl silicone resin, 30-40 parts of methyl vinyl silicone oil, 0.1-0.3 parts of a catalyst and 3-5 parts of a binding agent; the component B comprises the following raw materials in parts by weight: 50-60 parts of methyl silicone resin, 30-40 parts of methyl vinyl silicone oil, 1-4 parts of a cross-linking agent and 0.4-0.5 parts of an inhibitor. Compared with the prior art, the organic silicon packaging silica gel composition for COB packaging has the advantages of good light attenuation performance, strong vulcanization resistance, good sealing property and ageing resistance, good weather resistance, yellowing resistance, easiness for defoaming, convenience for operation and the like.