LED (Light Emitting Diode) encapsulation structure for decoration

The invention provides an LED (Light Emitting Diode) encapsulation structure for decoration. The LED encapsulation structure comprises a silicon carbide heat dissipation substrate, an LED luminous chip arranged on the substrate, a fluorescent-material-free resin layer covering the LED chip, a fluore...

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Bibliographic Details
Main Author SI HONGKANG
Format Patent
LanguageEnglish
Published 03.06.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides an LED (Light Emitting Diode) encapsulation structure for decoration. The LED encapsulation structure comprises a silicon carbide heat dissipation substrate, an LED luminous chip arranged on the substrate, a fluorescent-material-free resin layer covering the LED chip, a fluorescent-material-doped encapsulation adhesive layer arranged on the resin layer and a fog light layer arranged on the fluorescent-material-doped encapsulation adhesive layer, wherein the fog light layer comprises a resin adhesive and a plurality of optical microspheres of core-shell structures dispersed in the resin adhesive; each optical microsphere comprises a transparent core and a semi-transparent shell around the core; the optical microspheres are neatly and flatly arranged. Through the LED encapsulation structure, the light becomes soft; meanwhile, the influence of heat of the LED chip on the property of the fluorescent powder is eliminated.
Bibliography:Application Number: CN201510004145