Micromechanical sensor unit and method for manufacturing micromechanical sensor units

• Main Authors: JOCHEN REINMUTH, JULIAN GONSKA
• Format: Patent
• Language: English
• Published: 20.05.2015
• Subjects: GYROSCOPIC INSTRUMENTS; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT; MEASURING; MEASURING DISTANCES, LEVELS OR BEARINGS; MEASURING ELECTRIC VARIABLES; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK; MEASURING MAGNETIC VARIABLES; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; NAVIGATION; PERFORMING OPERATIONS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY; PHYSICS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; SURVEYING; TESTING; TRANSPORTING

A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are manufactured, in a second method step a sealable channel leading into the first cavity being created, in a third method step the first pressure in the first cavity being established via the sealable channel.