Improved three-dimensional chip integrated structure and processing technology thereof

• Main Author: JING XIANGMENG
• Format: Patent
• Language: English
• Published: 13.05.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides an improved three-dimensional chip integrated structure, which is simple in structure and low in requirement on manufacturing technology, further reduces packaging volume of the chip, and meanwhile reduces steps of TSV manufacturing technology and well reduces technological cost; the invention also provides the processing technology of the three-dimensional chip integrated structure at the same time. The improved three-dimensional chip integrated structure includes a substrate, and is characterized in that an adapter plate is connected with the substrate by a solder ball or a bump, a chip on the upper side is connected with the adapter plate by a first metal pad or a first bump, the chip on the upper side is connected with a chip on the lower side by a second metal pad or a second bump, a metal column structure is arranged on the substrate, the chip on the upper side is connected with the metal column structure by a third metal pad or a third bump. The invention also provides the processing technology of the improved three-dimensional chip integrated structure at the same time.