Double-side polishing method of 12-inch silicon wafer

• Main Authors: GE ZHONG, FENG QUANLIN, KU LIMING, WANG YONGTAO, YAN ZHIRUI
• Format: Patent
• Language: English
• Published: 29.04.2015
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention provides a double-side polishing method of a 12-inch silicon wafer. The method includes the steps of firstly, placing the silicon wafer in the carrier of a polishing machine, allowing he silicon wafer to move relative to an upper polishing pad and a lower polishing pad under the drive of a sun gear and an outer gear ring, and alternately changing the rotation direction of the carrier so as to polish the surface of the silicon wafer; using a brush plate to brush the upper polishing pad and the lower polishing pad after the silicon water is polished for every 1-3 hours, wherein purified water is sprayed to the polishing pads during the brushing; thirdly, using a diamond trimmer to trim the upper and lower polishing pads after the silicon water is polished for every 12-24 hours, wherein purified water is sprayed to the polishing pads during the trimming. The method has the advantages that the phenomenon that the abrasion loss at the center of the polishing pads is different from that at the edge of the polishing pads can be improved effectively, residual impurities on the surfaces of the polishing pads can be removed effectively by the brush plate, glazing speed of the polishing pads is slowed, heterogeneity in the silicon wafer and between silicon wafers can be lowered, the trimming times of the polishing pads are reduced, polishing stability is increased, and production cost is lowered.