Polyimide metal clad laminate

The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 80 to 90 mole % 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4'-oxydiphthalic...

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Bibliographic Details
Main Authors SIMONE CHRISTOPHER DENNIS, COX G. SIDNEY
Format Patent
LanguageEnglish
Published 22.04.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 80 to 90 mole % 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4'-oxydiphthalic anhydride and 100 mole % 2,2'-bis(trifluoromethyl) benzidine. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.
Bibliography:Application Number: CN201380042685