Manufacturing method of high-precision mask
The invention provides a manufacturing method of a high-precision mask, which comprises the following steps: thinning the perforated region of a mask substrate to a thickness penetrable for laser by using a half-etching process, applying tensile force to the periphery of the mask substrate to flatte...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
22.04.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a manufacturing method of a high-precision mask, which comprises the following steps: thinning the perforated region of a mask substrate to a thickness penetrable for laser by using a half-etching process, applying tensile force to the periphery of the mask substrate to flatten the surface, welding the mask substrate to a mask frame, and cutting the mask plate with a laser to obtain a hole with required pattern. The lasing beam with the diameter of 1 micrometer is utilized to perforate the mask substrate so as to enhance the perforation precision of the mask and the perforation position accuracy, thereby more accurately manufacturing the mask plate with designed perforation size. The lasing beam with the diameter of 1 micrometer can be utilized to make a hole with minimal linewidth in the mask plate, thereby enhancing the resolution of the display device. Besides, the equipment cost required by production is lowered, thereby obviously lowering the production cost of the mask. The manufacturing process is shortened, thereby greatly enhancing the production efficiency of the mask. |
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Bibliography: | Application Number: CN201510039433 |