Organosilicone packaging glue for packaging LED lamp filament

The invention provides organosilicone packaging glue for packaging an LED lamp filament. The glue is prepared from a component A and a component B in a weight ratio of 1: 1, wherein the component A is prepared from the following raw materials in parts by weight: 80-90 parts of vinyl silicone oil, 10...

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Bibliographic Details
Main Authors CHEN WEI, XU QINGKUN, WANG JIANBIN, CHEN TIANAN
Format Patent
LanguageEnglish
Published 22.04.2015
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention provides organosilicone packaging glue for packaging an LED lamp filament. The glue is prepared from a component A and a component B in a weight ratio of 1: 1, wherein the component A is prepared from the following raw materials in parts by weight: 80-90 parts of vinyl silicone oil, 10-20 parts of a thixotropic agent white carbon black and 0.1-0.3 part of a catalyst; the component B is prepared from the following raw materials in parts by weight: 75-95 parts of vinyl silicone oil, 5-15 parts of a catalyst, 2-5 parts of an adhesive and 0.1-0.3 part of an inhibitor. The LED lamp filament packaging silica gel provided by the invention is prepared from the components A and B. The component A provides the special thixotropic agent in the system, so that the glue has a good leveling property and strong operability while having good thixotropy. The light transmittance of cured glue is not decreased.
Bibliography:Application Number: CN2015132688