Chip four-corner binding glue and preparation method thereof

• Main Authors: ZHOU JIANZHONG, LIN ZHIXIU, LIN SHAOSHENG
• Format: Patent
• Language: English
• Published: 22.04.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention belongs to the technical field of chip protective glue and particularly relates to chip four-corner binding glue and a preparation method thereof. The chip four-corner binding glue is prepared from the following components in parts by weight: 20-25 parts of bisphenol A epoxy resin, 35-40 parts of bisphenol F epoxy resin, 0.5-1.0 part of pigment, 4-10 parts of white carbon black, 60-100 parts of spherical filler, 30-50 parts of sulfydryl ester, 1-2 parts of a stabilizer, 4-10 parts of a curing agent and 1-3 parts of a coupling agent. The four-corner binding glue prepared by the preparation method disclosed by the invention is not high in viscosity, good in thixotropy and relatively high in cross-linking density, so that the weather resistance is extremely good, the curing temperature is low, the bonding strength is high, the shrinking percentage is low, the storage is relatively stable and lasting, the preparation process is simple and environmentally friendly, the cost is low and the applied range is wide. Moreover, a product obtained by the preparation method disclosed by the invention is in liquid state, and beneficial to site construction and avoiding generating gas bubbles.