LED lamp

• Main Authors: FU BIN, QIAN WENDA, FU JIALIN
• Format: Patent
• Language: English
• Published: 08.04.2015
• Subjects: BLASTING; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; NON-PORTABLE LIGHTING DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

The invention discloses an LED lamp which comprises an LED chip, a heat-conduction substrate and a heat sink, wherein the LED chip comprises a plurality of lamp beads and is mounted on the heat-conduction substrate, the heat-conduction substrate is connected with a first surface of the heat sink, radiating fins are arranged on a second surface of the heat sink, and the heat-conduction substrate adopts a ceramic substrate (made from a material, such as aluminum nitride and aluminum oxide). When the LED lamp works, heat generated by the LED chip is firstly transmitted to the heat-conduction substrate and then is transmitted to the heat sink from the heat-conduction substrate, and the heat sink transmits the heat to air by virtue of the radiating fins, so that the heat can be quickly dissipated, and a problem of heat dissipation of the LED lamp is solved. The LED clamp has the benefits that the heat-conduction substrate adopts a ceramic substrate (made from the material, such as the aluminum nitride and the aluminum oxide), and the ceramic substrate (made from the material, such as the aluminum nitride and the aluminum oxide) self is insulated and does not conduct electricity, so that a short circuit situation does not occur when the LED chip is mounted on the heat-conduction substrate; besides, a heat conductivity coefficient of the aluminum nitride can reach 200 W/(m.K), so that a bottleneck problem of heat conduction of a high-power LED lamp can be effectively solved.