Heat-radiating insulating lining board, packaging module comprising lining board and manufacturing method thereof

• Main Authors: XU NINGHUA, WU YIBO, LIU GUOYOU, DAI XIAOPING
• Format: Patent
• Language: English
• Published: 01.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention discloses a heat-radiating insulating lining board applied to a power electronic module, a packaging module comprising the lining board and a manufacturing method thereof. The heat-radiating insulating lining board comprises an upper metallized layer, a ceramic layer, a lower metallized layer and a metal post array, wherein the upper metallized layer is located on the upper surface of the ceramic layer, the lower metallized layer is located on the lower surface of the ceramic layer, the ceramic layer is located between the upper metallized layer and the lower metallized layer, and the metal post array is connected with the lower metallized layer. The packaging module comprises the heat-radiating insulating lining board, a packaging housing and a liquid-cooled radiator, wherein the heat-radiating insulating lining board is installed on the surface of the liquid-cooled radiator through the packaging housing, and the metal post array is in direct contact with cooling liquid in a heat radiating passage to form a direct liquid-cooled heat radiating structure. The invention can solve the technical problem that the heat radiating efficiency of the traditional ceramic insulating lining board is low, improve the heat radiating path in the packaging module, enhance the heat radiating efficiency of the module and improve the thermal stability and long-term working reliability of the power module.