Thermal fatigue optimized design of perforated type high-gain optoelectronic system grade packaging structure

• Main Authors: GE YUPING, GUO FANGMIN
• Format: Patent
• Language: English
• Published: 01.04.2015
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

The invention discloses a thermal fatigue optimized design of a perforated type high-gain optoelectronic system grade packaging structure. The thermal fatigue optimized design of the packaging structure is characterized in that three-dimensional modeling, thermal fatigue analysis and collaborative simulation of a structure model, and adjustment structure parameters are subjected to a plurality of times of comparison validation of circulating convergence until the structure parameters with optimal electromagnetic and heat thermal fatigue performances are selected, and the optimized design is finished. Compared with the prior art, the thermal fatigue optimized design has the advantages of simple optimization process, short simulation period and accurate parameter extraction, so that the possibility of losing efficiency is reduced and reference evidences are provided for a production process; the utilization is convenient, direct and efficient and the design cost of the packaging structure is effectively reduced.