Removal device and method for PCBA (Printed Circuit Board Assembly) surface-mount chip soldering quality analysis

• Main Authors: WANG WEIPING, ZHAO PENG, ZHOU FENG, QU HONGTAO, BIN BIN, ZHANG JIAOWEN, GAO FENG, WEN ZHANYAN
• Format: Patent
• Language: English
• Published: 01.04.2015
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses a removal device and method for PCBA surface-mount chip soldering quality analysis and aims at solving the problem that an existing surface-mount chip is difficult to remove. The removal device for PCBA surface-mount chip soldering quality analysis comprises a PCBA clamp for fixing a PCBA, a removal unit arranged perpendicular to the PCBA, and a removal unit clamp for fixing the removal unit and capable of pulling the removal unit to move perpendicular to the PCBA. One end of the removal unit is adhered and fixed to a surface-mount chip removed from the PCBA. The adhesion force between the removal unit and the surface-mount chip removed from the PCBA is greater than the soldering force between the PCBA and the removed surface-mount chip. According to the removal device and method for PCBA surface-mount chip soldering quality analysis, the structure is simple and the operation is easy.