White light LED packaging structure and packaging method thereof

• Main Author: YAN CHUNWEI
• Format: Patent
• Language: English
• Published: 25.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a white light LED packaging structure which comprises an LED support bowl, at least one LED flip chip, a fluorescent powder film and a transparent silicon coating. The LED flip chip comprises a substrate, a luminous layer, an LED flip chip positive electrode and an LED flip chip negative electrode, wherein the luminous layer and the LED flip chip positive electrode are arranged on the two faces of the substrate respectively, and the LED flip chip negative electrode is arranged on the same face with the LED flip chip positive electrode or the luminous layer. The invention further discloses a packaging method of the white light LED packaging structure. The method comprises the steps that firstly a flip chip is arranged on the LED support bowl, secondly the fluorescent powder film is attached to the luminous layer of the LED flip chip, thirdly solidification is conducted, and finally transparent silicon is poured, baked and solidified. The packaging structure can lower the LED thermal resistance and increases the power of a single LED, the thicknesses of fluorescent powder on all areas of the surface of the chip are totally uniform, the LED light emitting quality is high, the light spot and halo phenomena are avoided, and the requirement for high illumination quality can be met.