LED packaging structure

The invention provides an LED packaging structure which comprises a silicon carbide heat-dissipating substrate, an LED light-emitting chip, a packaging adhesive layer doped with fluorescent materials and fog light layer. The fog light layer comprises resin adhesive and a plurality of single-layer se...

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Bibliographic Details
Main Author SI HONGKANG
Format Patent
LanguageEnglish
Published 25.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides an LED packaging structure which comprises a silicon carbide heat-dissipating substrate, an LED light-emitting chip, a packaging adhesive layer doped with fluorescent materials and fog light layer. The fog light layer comprises resin adhesive and a plurality of single-layer semitransparent microspheres which are horizontally laid and scattered in the resin adhesive. Part of the sides, close to a light-emitting face, of the semitransparent microspheres are removed so that semispherical concave surfaces can be formed. According to the LED packaging structure, light rays can become soft, ring-shaped bright points exist, and the LED packaging structure is suitable for indoor decorative lighting.
Bibliography:Application Number: CN20141640012