Thermal conductive glue adhered to heat dissipation plate and preparation method for thermal conductive glue

• Main Authors: GUO PINGSHENG, LI CHENG, WANG YONGMING, ZHAI DANDAN, WU JINLI, GAO ZHIXIANG, LI CHONG, LI SHIXUE
• Format: Patent
• Language: English
• Published: 25.03.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention relates to the field of utilizing thermal conductive glues and in particular relates to a thermal conductive glue adhered to a heat dissipation plate and a preparation method for the thermal conductive glue. The thermal conductive glue comprises room temperature vulcanized silicone rubber resin, a thermal conductive dispersant and an additive. The preparation method comprises the following steps: firstly pretreating a carbon nanotube to prepare the thermal conductive dispersant, and then blending the thermal conductive dispersant, silicone rubber and the additive. The thermal conductive glue and the preparation method have the benefits that the thermal conductive dispersant which is prepared by pretreating the multiwall carbon nanotube has good compatibility with the vulcanized silicone rubber and can uniformly disperse in an adhesive system without the phenomenon of aggregation and caking; meanwhile, as the multiwall carbon nanotube is high in thermal conductivity and is added in the adhesive system serving as a thermal conductive filler, the problem of non-ideal heat dissipation of the thermal conductive glue is completely solved, and the thermal conductivity coefficient is 15-32W/m*k; moreover, the preparation method is simple, the properties of the adopted raw materials are excellent, and the prepared thermal conductive glue is very ideal in application to a radiator of a computer and meets the requirements in various aspects.