Method for cutting a single crystal

The invention relates to a method for cutting a single crystal (1) having a first polar axis (P1) comprising the steps of arranging the single crystal (1) relative to a cutting tool (2) in such a way that the first polar axis (P1) is oriented perpendicular to an intended cutting plane (SE); arrangin...

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Bibliographic Details
Main Authors WINNACKER ALBRECHT, BICKERMANN MATTHIAS, EPELBAUM BORIS, SEITZ ULRICH, HEIMANN PAUL, FILIP OCTAVIAN
Format Patent
LanguageEnglish
Published 18.03.2015
Subjects
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:The invention relates to a method for cutting a single crystal (1) having a first polar axis (P1) comprising the steps of arranging the single crystal (1) relative to a cutting tool (2) in such a way that the first polar axis (P1) is oriented perpendicular to an intended cutting plane (SE); arranging at least one further single crystal (5) having a second polar axis (P2) in such a way that the first (P1) and the second polar axis (P2) are oriented substantially parallel but opposite one another; and simultaneously guiding a cutting tool (2) through the single crystal (1) and the at least one further single crystal (5) along the intended cutting plane (SE).
Bibliography:Application Number: CN2013831273