Tough high strength epoxy resin potting material and preparation method and application thereof

• Main Authors: YAN SUYUN, MIAO RONGLI, LI SONG, WANG BIN
• Format: Patent
• Language: English
• Published: 11.03.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention discloses a tough high strength epoxy resin potting material and a preparation method and application thereof, and belongs to the technical field of potting. The tough high strength epoxy resin potting material is prepared by compounding epoxy resin, hexanediamine, polysulfide rubber and glycidyl ether, the raw materials are easy to obtain, and the tough high strength epoxy resin potting material can be used in large scale for potting sophisticated electronic devices, and can effectively solve the problems of rubber layer cracking at high and low temperature, device damages, signal drift and the like. The preparation method of the tough high strength epoxy resin potting material has the advantages of simple operation, easy control, and suitability for industrialized popularization and application. The tough high strength epoxy resin potting material is used for potting electronic components, avoids damage and pulling destruction caused by excessive curing stress in the potting process of the electronic components, and has no cracks in high and low temperature change process, the electronic components and lead wires have no damage, and electrical signals do not drift.