Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material

• Main Authors: HIRANO MASANORI, HONDA SHIRO, TOMIOKA NOBUYUKI
• Format: Patent
• Language: English
• Published: 04.03.2015
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention provides a binder resin composition which can fix a base without the need of elevating/lowering the temperature of a preform mold. The binder resin composition for a preform comprises a heat-curable resin [A], a thermoplastic resin [B] and a curing catalyst [C], wherein the heat-curable resin [A] contains a bifunctional epoxy resin, the content of the thermoplastic resin [B] ranges from 10 to 100 parts by mass relative to 100 parts by mass of the heat-curable resin [A], and the curing catalyst [C] is at least one curing catalyst selected from an organophosphorous compound, an imidazole and derivatives thereof.