Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material

The invention provides a binder resin composition which can fix a base without the need of elevating/lowering the temperature of a preform mold. The binder resin composition for a preform comprises a heat-curable resin [A], a thermoplastic resin [B] and a curing catalyst [C], wherein the heat-curabl...

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Bibliographic Details
Main Authors HIRANO MASANORI, HONDA SHIRO, TOMIOKA NOBUYUKI
Format Patent
LanguageEnglish
Published 04.03.2015
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:The invention provides a binder resin composition which can fix a base without the need of elevating/lowering the temperature of a preform mold. The binder resin composition for a preform comprises a heat-curable resin [A], a thermoplastic resin [B] and a curing catalyst [C], wherein the heat-curable resin [A] contains a bifunctional epoxy resin, the content of the thermoplastic resin [B] ranges from 10 to 100 parts by mass relative to 100 parts by mass of the heat-curable resin [A], and the curing catalyst [C] is at least one curing catalyst selected from an organophosphorous compound, an imidazole and derivatives thereof.
Bibliography:Application Number: CN201380033681