SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

A semiconductor package is disclosed, which includes: a first substrate; a first semiconductor component disposed on the first substrate; a second substrate disposed on the first semiconductor component and electrically connected to the first substrate through a plurality of conductive elements; and...

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Bibliographic Details
Main Authors WANG LUNG-YUAN, CHIANG CHENGIA, SHIH CHIA-KAI, HSU CHUI, TUNG SHIH-HAO
Format Patent
LanguageEnglish
Published 25.02.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package is disclosed, which includes: a first substrate; a first semiconductor component disposed on the first substrate; a second substrate disposed on the first semiconductor component and electrically connected to the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate and encapsulating the first semiconductor component and the conductive elements. The present invention can control the height and volume of the conductive elements since the distance between the first substrate and the second substrate is fixed by bonding the second substrate to the first semiconductor component.
Bibliography:Application Number: CN201310375631