Acetal resin composition

• Main Authors: SADAO IBE, TADASHIGE HATA
• Format: Patent
• Language: English
• Published: 16.06.1999
• Edition: 5
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention provides an acetal resin composition comprising: (A) 100 parts by weight of oxymethylene copolymers generating 500 ppm or less of formaldehyde gas when heated at 230 DEG C for 60 minutes under nitrogen flow; (B) 0.05 to 2 parts by weight of hindered phenol type antioxidants generating 5 % by weight or less of volatile materials based on the total amount of the hindered phenol type antioxidants when heated at 230 DEG C for 60 minutes under air flow; and (C) 0.002 to 0.3 parts by weight of ion adsorbents selected from the group consisting of (i) an ion adsorbent comprising (a) one or more oxides selected from the alkaline metal oxides and the alkaline earth metal oxides and (b) one or more trivalent metallic oxides, and (ii) an ion adsorbent represented by the general formula: M1 1-x M2 x (OH)2 Ax/n . mH2O (1> wherein M1 is one or more bivalent alkaline earth metal atoms, M2 is a trivalent metal, A is an anion of valence n, 0 < X </= 0.5, and m is a positive number. The acetal resin compositions are capable of avoiding the formation of molding deposits and the smell of formaldehyde gas during mold processing and show excellent heat stability.