Device for chemical plating

• Main Authors: YAO ZHIJUN, XIN HONG, YAO WENDI
• Format: Patent
• Language: English
• Published: 18.02.2015
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a device for chemical plating. The device comprises a plating tank, wherein a heating tank is arranged below the plating tank; a heater is arranged in the heating tank; a cooler is arranged at the bottom of the heating tank and below the heater; a pump is arranged at one side of the heating tank; an inlet pipeline of the pump is communicated with the bottom of the heating tank, an outlet pipeline of the pump is communicated with an inlet of a filter, and an outlet pipeline of the filter is communicated with the lower part of the plating tank and the upper part of the heating tank respectively; one end of an overflow pipe is communicated with the upper part of the plating tank 1, and the other end of the overflow pipe is connected with the heating tank; the overflow pipe is arranged below the plating tank, one end of the overflow pipe is communicated with the upper part of the plating tank 1, and the other end of the overflow pipe is connected with the heating tank. The device disclosed by the invention is simple in structure and convenient to operate, the heating of a plating solution and plating are performed separately, and the temperature of the plating solution in the plating tank is easy to adjust and is uniformly distributed, and thus the quality of a plated layer is improved.