Polyimide resin composition, film, adhesive agent and component

• Main Authors: KIBA SHIGEO, IIDA KENJI, IMAGAWA KIYOMI, TOMITA YUSUKE
• Format: Patent
• Language: English
• Published: 04.02.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

The polyimide resin composition of the present invention at least comprises a polar solvent and a polyimide resin, where the viscosity-average molecular weight of the polyimide resin is 0.6 to 1.60. 95 to 100 mol% of total monomer of the polyimide resin is an aromatic monomer including no aliphatic chain having 3 or more carbon atoms on the main chain, where the aromatic monomer includes a monomer (A) having at least one benzophenone skeleton represented either by chemical formula (1) or (2) in an amount of 5 to 30 mol% in the total monomer, a monomer (B) having a diphenyl ether skeleton, which is free of a biphenyl skeleton, in an amount of 40 to 95 mol% in the total monomer, and a monomer (C) having a biphenyl skeleton in an amount of less than 45 mol% in the total monomer, and 20 to 95 mol% of the monomer (B) in the total monomer constituting the polyimide resin has three or more aromatic rings.