Electro-deposition device of through hole of HDI printed circuit board

• Main Authors: SHU ZHIHUA, QIU BINGCHAO, GAO YUNFANG, ZHAN YOUGEN, PAN QING
• Format: Patent
• Language: English
• Published: 28.01.2015
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to the technical field of HDI printed circuit board through hole processing, in particular to an electro-deposition device of a through hole of an HDI printed circuit board. The electro-deposition device comprises an electroplating bath (1), a first positive electrode (2), a second positive electrode (3) and a negative electrode (14), wherein the first positive electrode (2) and the second positive electrode (3) are respectively connected with positive electrode binding posts of a first rectifying power supply (4) and a second rectifying power supply (5) through leads; the negative electrode (14) is connected with negative electrode binding posts of the first rectifying power supply (4) and the second rectifying power supply (5) through leads on a negative electrode clamp (15); the negative electrode (14) moves along with a bracket. Due to the arrangement, current in two positive electrode circuits can be adjusted, the current density of positive electrodes in two electroplating loops can be adjusted, and furthermore the concentration of two metal positive ions in an electroplating liquid is changed; the current distribution on the surface of the positive electrode and the dispersion property of the electroplating liquid are improved by changing the distance between the negative electrode and the positive electrode.