Apparatus for processing fragile substrate using multi lasers and method thereof

Disclosed herein is an apparatus for processing a fragile substrate using multi lasers. The apparatus comprises a picosecond laser device which generates a first laser pulse with a picosecond-level pulse width; a femtosecond laser device which generates a second laser pulse with a femtosecond-level...

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Bibliographic Details
Main Authors HYUNG-YOON JUNG, HEUNG-HYUN SHIN, JANG-HYUN KIM
Format Patent
LanguageEnglish
Published 21.01.2015
Subjects
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
GLASS
MACHINE TOOLS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:Disclosed herein is an apparatus for processing a fragile substrate using multi lasers. The apparatus comprises a picosecond laser device which generates a first laser pulse with a picosecond-level pulse width; a femtosecond laser device which generates a second laser pulse with a femtosecond-level pulse width; a laser controller which calculates a time difference between the first and second laser pulses, delaying the first or second laser pulse according to the time difference, and outputting the first and second laser pulses as third and fourth laser pulses respectively; a reflecting mirror which changes the direction of the third or fourth laser pulse; and a lens which allows the third and fourth laser pulses to pass through and enables the third and fourth laser pulses to be overlapped.
Bibliography:Application Number: CN201410277053