Image pickup module and method for manufacturing image pickup module
In this image pickup module, size and thickness are reduced, while removing causes of image failures and the like. In an image pickup module (1), a solid-state image pickup element (3) and a flexible substrate (2) are flip-chip bonded, and an opening (5) that is provided in the flexible substrate (2...
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| Main Author | |
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| Format | Patent |
| Language | Chinese English |
| Published |
24.12.2014
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| Subjects | |
| Online Access | Get full text |
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| Abstract | In this image pickup module, size and thickness are reduced, while removing causes of image failures and the like. In an image pickup module (1), a solid-state image pickup element (3) and a flexible substrate (2) are flip-chip bonded, and an opening (5) that is provided in the flexible substrate (2) is formed by melting the flexible substrate (2) and an anisotropic conductive film (8) adhered to the flexible substrate (2). |
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| AbstractList | In this image pickup module, size and thickness are reduced, while removing causes of image failures and the like. In an image pickup module (1), a solid-state image pickup element (3) and a flexible substrate (2) are flip-chip bonded, and an opening (5) that is provided in the flexible substrate (2) is formed by melting the flexible substrate (2) and an anisotropic conductive film (8) adhered to the flexible substrate (2). |
| Author | SAKOTA NAOKI |
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| Notes | Application Number: CN201380017040 |
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| RelatedCompanies | SHARP KABUSHIKI KAISHA |
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| Snippet | In this image pickup module, size and thickness are reduced, while removing causes of image failures and the like. In an image pickup module (1), a solid-state... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Image pickup module and method for manufacturing image pickup module |
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