Image pickup module and method for manufacturing image pickup module

In this image pickup module, size and thickness are reduced, while removing causes of image failures and the like. In an image pickup module (1), a solid-state image pickup element (3) and a flexible substrate (2) are flip-chip bonded, and an opening (5) that is provided in the flexible substrate (2...

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Bibliographic Details
Main Author SAKOTA NAOKI
Format Patent
LanguageChinese
English
Published 24.12.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In this image pickup module, size and thickness are reduced, while removing causes of image failures and the like. In an image pickup module (1), a solid-state image pickup element (3) and a flexible substrate (2) are flip-chip bonded, and an opening (5) that is provided in the flexible substrate (2) is formed by melting the flexible substrate (2) and an anisotropic conductive film (8) adhered to the flexible substrate (2).
Bibliography:Application Number: CN201380017040