PIEZOELECTRIC DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper p...

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Bibliographic Details
Main Authors YASUDA KATSUSHI, CHA SANG-YEOB, LEE SOON-BUM, LEE JONG-PIL
Format Patent
LanguageChinese
English
Published 17.12.2014
Subjects
ELECTRICITY
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Summary:A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case.
Bibliography:Application Number: CN201410239007